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Printed circuit boards

The following circuit board technologies are used. We are always looking for suppliers who have qualified new, innovative technologies in their manufacturing process.

Single-sided Printed Circuit Board

Finished copper 35 µm, 70 µm - surface: HAL lead-free (SnCuNi))

Double-sided Printed Circuit Board

Plated-through, finished Copper 35 µm, 70 µm, 105 µm
Surface: HAL lead-free (SnCuNi), chem. Ni / Au

Multilayer 4 to 8 Layer

Finished copper 35 µm, 70 µm
Surface: HAL lead-free (SnCuNi), chem. Ni / Au

HDI-Multilayer 8 to 10 Layer

SBU structure, surface chem. Ni / Au

Rigid-Flex-Multilayer 4 to 6 Layer

Finished copper 35 µm, 70 µm
Surface: HAL lead-free (SnCuNi), chem. Ni / Au

Alu-Core Printed Circuit Board Single-Sided

Finished copper 35 µm, 70 µm
Surface: HAL lead-free (SnCuNi), chem. Ni / Au